SmartApe AI

Oct 25, 2026 · Artificial Intelligence

Wafer-Scale AI Chips: Co-Designing for 4x Token-per-Dollar Gains

Tsinghua's Hu Yang presents wafer-scale chip co-design to overcome communication, power, and density walls, achieving 1.21x token-per-dollar over NVL72-GB200 with domestic process and 4x with 4nm, via integrated architecture, interconnect, fault tolerance, and thermal management.