HBM, a vertically stacked DRAM technology, is evolving to HBM3E with up to 8 Gbps speed and 16 GB capacity, driving explosive growth in AI server demand, reshaping market shares among SK Hynix, Samsung and Micron, and relying on CoWoS and TSV packaging advances.
The article explains how High Bandwidth Memory (HBM) technology has evolved to HBM3E, details its technical advantages, outlines the rapid growth of AI server shipments, projects a $15 billion HBM market by 2025, and analyzes the competitive landscape of major suppliers and packaging methods.
The article analyzes Taiwan’s mature ICT ecosystem, its dominant share in global server OEM/ODM production, the surge in AI compute demand driven by large language models, and how companies like Wistron, Quanta and Inventec are positioned to benefit from expanding AI server and CoWoS markets.
The article reviews the Hot Chips 33 conference, highlighting TSMC’s latest 3D packaging technologies—including SoIC, InFO, and CoWoS—their design flows, thermal analysis methods, test results, and future roadmap, while also summarizing contributions from other industry leaders.
