Architects' Tech Alliance
Aug 26, 2026 · Industry Insights
Hot Chips 2026: HBM’s Shift to Integrated Base‑Die and 3D‑DRAM’s Alternative Roadmap
At Hot Chips 2026, Samsung, SK Hynix and Micron warned that traditional HBM is nearing physical limits and outlined a three‑stage roadmap that moves from stacking to integrated Base‑Die, while d‑Matrix showcased a 3D‑DRAM solution delivering ~100 TB/s bandwidth but with limited capacity, highlighting packaging and power challenges as the next competitive frontier.
3D-DRAMAI inferenceBase Die
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