Architects' Tech Alliance

Jul 7, 2022 · Industry Insights

What’s Next in 3D Chip Packaging? Inside TSMC’s SoIC, InFO, and CoWoS Advances

The article reviews the Hot Chips 33 conference, highlighting TSMC’s latest 3D packaging technologies—including SoIC, InFO, and CoWoS—their design flows, thermal analysis methods, test results, and future roadmap, while also summarizing contributions from other industry leaders.