Why Optical Interconnects Are the Next Bottleneck‑Breaker for Massive AI Clusters
This article systematically examines the demand, technology stack, and industry landscape of large‑scale AI compute clusters, highlighting the limitations of traditional copper interconnects and presenting device‑level and chip‑level optical interconnect solutions—including OCS, pluggable modules, silicon photonics, VCSEL, and micro‑LED—while outlining current challenges and future directions.
